Low Voiding Solder Pastes

ALPHA^® OM-362 is a lead-free, zero-halogen, no-clean solder paste designed to provide ultra-low voiding performance on all component types including bottom termination components.

ALPHA^® OM-362 achieves IPC-7095 Class 3 voiding on BGA components and less than 10% voiding on bottom termination components. This paste is designed for ultra-low voiding performance with high reliability alloys such as Innolot as well as traditional SAC alloys.

• Ultra-Low voiding performance
• Excellent electromigration characteristics
• Good coalescence and wetting performance
• Excellent solder joint and flux residue cosmetics
• Zero-halogen, No halogens intentionally added