Solutions

Our technical staff at our world class applications facilities will work closely with you and third-party semiconductor plating tool providers to optimize performance on the most advanced wafer features.

Our applications engineers will help to codesign a high-volume process solution that meets your design, throughput and yield goals. We are experts in dispensing, printing, films and bonding.

Our applications experts have designed solder assembly process solutions integrating our fluxes, preforms and pastes to create metal connections to meet electrical and thermal design goals and exceed productivity targets

Our Permanent Marking process solutions involve use of colored thermosetting inks that can be deposited though printing, stamping, rolling or spraying to meet your design goals, product function and component tracking needs.