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Excellent Soldering Yield on Various Finishes
Semiconductor Solutions no clean and water soluble paste flux delivers robust and high yield for solder ball attach, flip chip and other soldering applications.
Robust Application for Various Package Designs
ALPHA Paste Flux is the leading choice of solder flux for wafer level CSP, Flip chip and BGA/ CSP ball attach applications.
- Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process.
- Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates.
- Excellent material stability whereas the flux maintains tack and viscosity over multiple print cycles.
- Excellent cleanability performance in that residues are easily cleaned with DI water.
View Products in Solder Flux
- ALPHA® WS-698
ALPHA WS-698 is a water soluble high activity paste flux which delivers excellent solder wetting on challenging finishes and enables low voiding performance.
- Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process
- Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates
- Excellent cleanability performance in that residues are easily cleaned with DI water
- ALPHA® WS9180-MHV
Water soluble paste flux for wafer level ball attach on both Fan-in and Fan-out applications.
- Excellent activity allows for excellent soldering to Cu, Cu OSP and ENIG soldering process
- Excellent material stability – maintains viscosity tack and viscosity over time
- Wide process window for maximum application flexibility especially for wafer level ball attach
- Excellent print and pin-transfer stability
- ALPHA® WS-608
ALPHA WS-608 is a water soluble high activity paste flux which delivers excellent solder wetting on challenging finishes, excellent cleaning and enables low voiding performance.
- Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process
- Superior wetting maximizing assembly yields to provide highest ball attach yield rates
- Excellent cleanability performance in that residues are easily cleaned with DI water
- ALPHA® NCX-402-M3
No clean paste flux which enables low residue post reflow with low voiding and excellent soldering performance.
- Good thermal stability, tack strength and high activity for excellent yield rates
- Ultra low residue post reflow; <10% by Wt
- IPC-J-STD-004 compliant for long term electrical reliability
- Halide and halogen-free formulation
- ALPHA® WS-630
ALPHA WS-630 is a water soluble high activity paste flux that delivers excellent solder wetting on challenging finishes and enables low voiding performance.
- Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process
- Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates
- Excellent cleanability performance in that residues are easily cleaned with DI water
- ALPHA® NCX-PRL507
ALPHA NCX-PRL507 is an epoxy paste flux for wafer level ball attach for both Fan-in and Fan-out applications. It can also be used as a flip chip flux for wafer level packaging.
- Superior activity, wetting, and assembly yield rates
- High Tg polymer reinforcement layer
- Excellent material stability – maintains tack and viscosity over multiple print cycles
- Improved ball shear strength, drop shock, and temperature cycle reliability performance
- KESTER SE-CURE 9665
No clean low residue liquid flux for indium solder preform thermal interface lid attach.
- Excellent soldering especially for indium solder preforms
- Very low voiding even after multiple reflows for indium TIM application
- KESTER TSF-ULR18
No clean paste flux with low residue post reflow and low voiding performance.
- Ultra low residue post reflow; <10% by Wt
- Excellent for Flip Chip on leadframe package
- Halide and halogen-free formulation
- KESTER TSF-6592HF
No clean paste flux with high activity and clear residues.
- Bright shiny solder joints with clear residues
- Aggressive flux on various substrates such as OSP-Cu, immersion finishes and ENIG
- Clear non-tacky residues
- High tack to minimize skewing of components
- KESTER TSF-6522RH
No clean rosin-based paste flux with high tackiness and long pot life.
- High tack values and long tack life
- ROL0 IPC classification
- Excellent for Flip chip on lead and flexible circuits application
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