Application Overview
Heterogenous integration of 2.5/3D packaging involves interconnecting active or passive components using vertical stacking or embedded structures to achieve system level functionality in a single package. Various process technology and material solutions are required to enable stacking or embedding functions into a system level package.
![MAES-Application-Heterogenous](/sites/default/files/2021-09/SS_application-detail-Heterogenous.jpg)