View Solutions in Solder Assembly
MacDermid Alpha materials provide optimum solutions for the interconnect of miniaturized components and high density, fine-pitch passives assembly.
Flip Chip Attach
Flip chip attach process entail picking up of a singulated die, “flipping” and then interconnecting them onto a substrate using soldering material.
Sphere attach process utilize flux that is typically applied via pin transfer from a flux dipping tray for BGA and CSP packages. Solder spheres are subsequently attached and reflowed to from a complete package.
Clip attach process connects die and lead by a solid copper bridge with adhesive bonding or soldering.