ISPEC 2025

Advancing Power Electronics with High-Reliability Sintering & Assembly Solutions

We are exhibiting at ISPEC 2025, taking place March 4-7 in Gandhinagar, India. As a global leader in electronic materials, we are committed to driving innovation in power electronics, semiconductor packaging, and advanced interconnect solutions.

At ISPEC 2025, we will showcase Argomax^® sintering technology, high-performance soldering solutions, and STIM (Sintering Technology for Interconnect Materials)—technologies engineered to enhance efficiency, reliability, and thermal management in India's growing automotive and EV sectors.

Powering the Future of India's EV & Semiconductor Industries

With India’s rapid adoption of electric mobility and advanced power electronics, MacDermid Alpha’s solutions are at the forefront of technological advancement. Our next-generation materials are designed to optimize inverters, converters, on-board chargers, and high-power semiconductor devices, ensuring superior reliability and long-term performance.

We invite you to explore our cutting-edge solutions, including:

• Argomax^® Sintering Technology – Industry-leading sinter materials for die-attach and substrate-attach applications, improving thermal conductivity, mechanical strength, and overall module reliability in EV power modules and high-power electronics.
• ALPHA^® Soldering Solutions – High-reliability solder pastes, preforms, and fluxes engineered to enhance thermal and mechanical performance in semiconductor packaging and power electronics applications.
• STIM (Sintering Technology for Interconnect Materials) – A breakthrough material system for high-power device assembly, delivering superior thermal dissipation, high-reliability interconnects, and process efficiency.

Join us at ISPEC 2025 to engage with our team of specialists and learn how our advanced materials are shaping the future of India’s power electronics, EV, and semiconductor industries.

• Explore high-performance sintering and assembly materials.
• Discuss innovative solutions for next-gen automotive electronics.
• Discover how our materials optimize power device efficiency and reliability.

Connect with us at Booth A5 and experience how MacDermid Alpha is enabling the next generation of power electronics and semiconductor assembly.

See you at ISPEC 2025 in Gandhinagar, India!