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SMTA International Conference & Exposition

Donald E. Stephens Convention Center

Rosemont
60018
United States
Trade Show
Assembly
Semiconductor
Discover advanced electronics solutions at SMTA International 2024. Join us at Booth 2712 to explore innovations that enhance your product’s performance and reliability across the entire electronics supply chain.
SMTAI 2024

We invite you to visit us at SMTA International 2024, where we will present our comprehensive suite of integrated solutions. Designed to meet the evolving needs of circuit board assembly, semiconductor manufacturing, wafer-level packaging, and circuitry solutions, our offerings set the industry standard for performance and reliability.  

Learn more about our featured solutions: 

ALPHA® CVP-390V Innolot® MXE: Our next-gen high-reliability solder paste, enhances thermal cycling, vibration and drop shock performance, while delivering superior electrochemical reliability, extending system life in the most extreme conditions.  

ALPHA® Telecore® HF-850: A halogen-free, low-spatter cored wire offering fast wetting for drag soldering, reducing cycle times in both robotic and hand applications. Its clear residue allows easy inspection, while low spatter improves board aesthetics and operator comfort. Environmentally compliant, it ensures safety while optimizing process efficiency.

Electrolube® Thermal Interface Materials (TIMs): As electronics grow more complex and generate more heat, effective thermal management becomes critical. To address these demands, our TIMs product line offers thermally conductive gap pads, one-part thermal gels, and thin dielectric sheets, all engineered to enhance system performance and extend lifetimes.

Electrolube® 2K301P conformal coating provides resin-like durability with increased thickness, better edge coverage, and flexibility, ensuring advanced protection in harsh environments.  

ALPHA® Hitech Solutions: provide a comprehensive suite of high-performance adhesives, underfills, edgebonds, and encapsulants. Engineered to reduce package strain and enhance board-level reliability, these solutions are suitable for various applications, including automotive, camera modules, mobile devices, computing, white goods, and LED assemblies.

As a global leader in material solutions, we ensure reliability through our expertise and data-driven material choices. Connect with our experts at Booth 2712 to discover how our advanced offerings can elevate your electronic manufacturing processes. With a comprehensive portfolio of board-level technologies, we are committed to partnering on innovative solutions that streamline operations and drive progress for our customers.