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Source India 2025

Chennai Trade Centre

Chennai
600 089
India
Trade Show
Assembly
Semiconductor
Explore our advanced solutions at Source India 2025 and see how we deliver innovative solutions across the entire electronics value chain. Visit us at booth A5, Hall 2 & 3, to find out how we can optimize your product's performance and reliability.
Source India 2025

MacDermid Alpha is excited to participate in Source India 2025, where we will present a comprehensive range of integrated solutions tailored to meet the evolving needs of circuit board assembly, semiconductor manufacturing, wafer-level packaging, and circuitry solutions. Designed for exceptional performance and reliability, our offerings set new industry standards and address the challenges of modern electronics manufacturing. We invite you to explore our featured offerings, including:

ALPHA® CVP-390V Innolot® MXE: Our next-generation high-reliability solder paste enhances thermal cycling, vibration and drop shock performance, while delivering superior electrochemical reliability, extending system life in the most extreme conditions.

Electrolube® 2K301P Conformal Coating: Provides resin-like durability with increased thickness, better edge coverage, and flexibility, ensuring advanced protection in harsh environments.

Electrolube® Thermal Interface Materials (TIMs): As electronics grow more complex and generate more heat, effective thermal management becomes critical. To address these demands, our TIMs product line offers thermally conductive gap pads, one-part thermal gels, and thin dielectric sheets, all engineered to enhance system performance and extend in-use life.

ALPHA® Hitech Solutions: Offer a comprehensive suite of high-performance adhesives, underfills, edgebonds, and encapsulants. Engineered to reduce package strain and enhance board-level reliability, these solutions are suitable for various applications, including automotive, camera modules, mobile devices, computing, white goods, and LED assemblies.

ALPHA® Argomax®: Engineered sinter materials proven to deliver the best process times and reliability, featuring flexible and easy-to-use form factors. These advancements help reduce capital costs and accelerate time to market. Whether in semiconductor packaging or high-power electronics, Argomax® elevates performance and extends the lifespan of your devices.

As a global leader in material solutions, we deliver reliability through our expertise and data-driven insights that guide the most important material choices. Connect with our experts at Booth A5 to learn how our advanced offerings can optimize your electronic manufacturing processes. With a comprehensive portfolio of board-level technologies, we are committed to developing solutions that streamline operations and drive progress for our partners.

 

Interested in learning more? Explore the resources below:

ALPHA® Argomax® Power Electronics Brochure

ALPHA® ATROX® Power Electronics Brochure

ALPHA® CVP 390V Innolot MXE Solder Paste Flyer

ALPHA® OM-362 Solder Paste Flyer

ALPHA® OM-565 HRL3 Solder Paste Flyer

ALPHA® Solder Preform Brochure

ALPHA® HiTech Brochure

ALPHA® HiTech CF31-4026 Edgebond Flyer

Electrolube® 2K301P Conformal Coating Flyer