Visit MacDermid Alpha Electronics Solutions at NEPCON Japan 2024

Attendees are cordially invited to visit Booth E35-48 where MacDermid Alpha will feature its integrated solutions to enable device designers and production engineers to meet the ever-evolving and rigorous needs of the semiconductor industry. Spotlighting our innovative technologies: ViaForm®, Argomax®, Electrolube®, and ALPHA® HiTech® product lines.

• ViaForm Advanced Damascene copper plating technology delivers superior filling performance for wafer fabrication. This advancement provides a high degree of process control enabling more robust interconnect fill performance and improved device reliability. 
• Argomax Silver Sintering pastes offer flexibility and ease-of-use while reducing total cost of ownership and time to market. These pastes, applied by low-pressure processing are designed for die, top side, or package attach. Designed for Power Electronics, Argomax provides high thermal and electrical performance.
• Electrolube with its wide range of chemicals for electronics: including conformal coatings, potting compounds, and thermal management materials, helps enhance durability and ensure optimal performance in diverse environments.
• ALPHA HiTech Polymer Reinforcement Solutions offer a full line of high-performance adhesives, underfill, edgebond, and encapsulant materials to enhance structural integrity and reliability.

Visitors will have the chance to connect with MacDermid Alpha’s experienced technical support team, gaining insights into technologies that can empower electronics designers and engineers worldwide to enhance the performance, reliability, and sustainability of their products.

Join the MacDermid Alpha team at NEPCON Japan 2024 to discover how to Power your Path to the future of semiconductors.