Visit MacDermid Alpha Electronics Solutions at the SMTA China East Conference 2024

Driving Enhanced Reliability

Leveraging over 20 years of industry experience, William Yu, Business Development Manager, will feature a next-generation high-reliability solder alloy, engineered to meet the growing demands of automotive electronic applications in his presentation on April 25th, 2024, at 14:20 in Room No.6, B2.

This presentation will navigate the challenges posed by harsh operating conditions, increased power densities, and miniaturization, for which traditional surface mount solders are no longer suitable to address. Through a blend of innovative metallurgical techniques, including solid solution & precipitation strengthening, grain refinement, and diffusion modifiers, this new high-reliability solder alloy is designed to outperform conventional Sn-Ag-Cu alloys. This special research showcase will highlight the alloy's superior thermal cycling and drop shock performance, validated through various reliability tests. Attendees will gain insights into how our new innovative solution combines enhanced reliability and performance to drive the future of innovation.  

Key Takeaways:

• Extend system life with our advanced high-reliability alloy, which exhibits significant improvements in thermal cycling compared to other high-reliability offerings.  
• Learn more about the potential applications and benefits for automotive electronics.

Take the opportunity to join William Yu in exploring advancements in the Surface Mount Technology (SMT) industry. We look forward to welcoming you at Room No.6, B2.