MacDermid Alpha launches ALPHA® SF828-MBB photovoltaic liquid flux for advanced multi-busbar interconnections

MacDermid Alpha Electronics Solutions, a leader in integrated materials and technologies for the electronics industry, introduces ALPHA® SF828-MBB. Designed for soldering small surface areas of wire and delivering excellent peel force and high machine cleanliness, this is our latest liquid flux for the photovoltaic market. 

ALPHA SF828-MBB contains a unique blend of ingredients that overcome the smaller surface area of wire ≤0.4mm used in ever-evolving multi-busbar technology to achieve excellent interconnection. The flux delivers fast wetting with minimal or no heating prior to wire ribbon dipping for higher process efficiency. 

“MacDermid Alpha developed ALPHA SF828-MBB to meet the photovoltaic market’s drive to create applications that provide improved efficiency and reliability,” comments Bernice Chung, Product Manager – Wave Soldering Products at MacDermid Alpha. “The high peel strength provided by ALPHA SF828-MBB ensures long-term reliability of the solder joints for long module life. It also delivers excellent soldering yields and ribbon-cell interconnection.” 

During field trials, ALPHA SF828-MBB exhibited less residue, which supports higher power transfer efficiencies and less equipment maintenance. User feedback also noticed superb adhesion and no yellowing bubbling across different EVA laminations. 

To find out more, reach out to us at www.macdermidalpha.com/contact-us