Unlock Tomorrow's Semiconductor Potential with MacDermid Alpha Electronics Solutions to enhance advanced package reliability and performance at IMAPS 2024

Experts from MacDermid Alpha will present two papers during the IMAPS Conference. Discover how to enhance device reliability, a paper titled ‘Exploring the Engineering of Copper Grains to Electroplate Bamboo-Like Structures and Foster Cu (111) Oriented Films’ will be presented by Dr. Abdelhamid ElSawy, on March 19, at 2 pm session TP1.  

 The second presentation, ‘An Innovative OSP Surface Finish for IC Substrate Packaging Applications’ takes place on March 21, at 10 am session THA2. Dr. Frank Xu will reveal the significance of OSP Surface Finish for IC Substrate Packaging Applications in addition to the correlation between coatings, cleaning agents, and other variables that dictate the effectiveness of OSP. 

MacDermid Alpha will focus on its advanced interconnect metallization and assembly innovations that empower semiconductor designs. From solutions for IC substrates including the Systek® family of high-performance build-up processes, to our ViaForm® copper damascene technologies for wafer fabrication. In addition to solutions for power electronics including the ALPHA® Argomax® engineered sinter materials and Atrox® PFAS-free conductive die attach products. These solutions enable enhanced reliability and reduced time-to-market for advanced packages.   

 Unlock your semiconductor potential with the broad range of high-performing products and processes from MacDermid Alpha. Find us at booth 13-14, for more details and to register please visit IMAPS Device Packaging Conference 2024 | MacDermid Alpha