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Conductive Die Attach Products
ATROX conductive die attach products offer a complete solution with lower total cost of ownership ushering in a new era of high performance materials.
Features
- Excellent thermal conductivity > 5 W/m-K
- Produces high thermal and electrical conductivity silver bonds with conventional die attach film processes.
- Can be laminated on wafer backside with moderate temperatures (< 100C).
Conductive Die Attach Film
ATROX CF100-7B is a unique conductive film adhesive with both electrical and thermal conductive properties. The unique chemistry allows excellent process flexibility and superior reliability performance for a variety of die sizes used for semiconductor applications. The film has excellent adhesion to silicon wafers and commonly used leadframe surface finishes such as BGA substrates, bare Cu, Ag and NiPdAu.
ATROX CF100-7B
| Product Name | Die Attach Format | DA Funcitional Property | Die Attach Technology |
|---|---|---|---|
| ATROX CF100-7B | Film | Conductive | Polymer |
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