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Product Overview
STAYSTIK 371 thermoplastic adhesive paste is designed for use in a variety of electronic applications. STAYSTIK 371 is characterized by excellent bonding at low process temperatures and extremely low elastic modulus (60,000psi).
The compliancy of this adhesive allows for the bonding of two materials with large dissimilarities in thermal expansion coefficients (TCEs). The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.
Features
- Fast bonding to a variety of substrates
- Easily reworkable material
STAYSTIK 371 Adhesive Technical Data Sheet English
STAYSTIK 371
|
Product Name |
Adhesive Type |
Adhesive Format |
Adhesive Technology |
Adhesive Application |
Deposition Method |
Silver |
|---|---|---|---|---|---|---|
|
STAYSTIK 371 |
Non-conductive |
Paste |
Insulating |
Structural Bonding |
Dispensing |
None |
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