Product Overview

STAYSTIK 611 thermoplastic adhesive film is ideal for applications where resistance to high temperature excursions is desired. This adhesive film can be used for die attach in solder sealed, hermetic packages and demonstrates low RGA moisture readings. This high temperature, reworkable thermoplastic system offers many unique advantages in applications traditionally ill-suited to thermoset adhesives.

Features

  • Meets MIL STD 883 requirements
  • Extremely low outgassing
  • Fast bonding to a variety of substrates
Technical Data Sheet
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STAYSTIK 611 Adhesive Technical Data Sheet English

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STAYSTIK 611

Product Name

Adhesive Type

Adhesive Format

Adhesive Technology

Adhesive Application

Deposition Method

Silver

STAYSTIK 611

Non-conductive

Film
Preforms

Thermally Conductive

Structural Bonding
Reworkable
Die Attach

Lamination
Pressure Bonding
Pick & Place

Aluminum Nitride

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 211

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 211

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Sensors Aerospace Applications Wafer Fabrication Optoelectronics Packaging Medical Devices

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Sensors Aerospace Applications Wafer Fabrication Optoelectronics Packaging Medical Devices

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 211

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 211

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Sensors Aerospace Applications Wafer Fabrication Optoelectronics Packaging Medical Devices

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Sensors Aerospace Applications Wafer Fabrication Optoelectronics Packaging Medical Devices

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding
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