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Product Overview
ALPHA Argomax 2010C is a specifically designed sintering film for high-volume, low-pressure sintering die attachment with a design that promotes ease of printing and the limitation of particulates.
Product Features
- Applications: Die Attach, Die Top Attach
- Formulated for printing on Ag/Au surfaces
- Designed for die placement on dried paste
- Pure Silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Proven long stencil life
Solutions Brochure
ALPHA Argomax Power Electronics Brochure English
ALPHA Argomax功率电子 宣传册 简体中文
Proven reliability in automotive applications
ALPHA Argomax 2010C Paste is a silver sintering die attach material specifically designed for die placement on dried paste followed by low-pressure sintering.
After sintering, it forms a high thermal and electrically conductive pure silver bond between the die and substrate. This high quality bond enables increased reliability and product life.
Related Products
| Product Type | Product | Compatible Surface Finish | Product Application Method | End Application |
|---|---|---|---|---|
| Sinter Paste | ALPHA Argomax 2040 Paste | Ag, Au | Print, Dot Dispense | Die Attach, Die Top Attach |
| Sinter Paste | ALPHA Argomax 5022 Paste | Cu | Die Attach, Die Top Attach | |
| Sinter Film | ALPHA Argomax 8020 Film | Ag, Au | Direct Transfer Film | Die Attach, Die Top Attach, Spacer Attach |
| Engineered Sinter Product | ALPHA Argomax 6500 BondPad | |||
| Engineered Sinter Product | ALPHA Argomax 9200 Preform | Ag, Au | Pick & Place | Die Top Attach, Package/Module Attach, Substrate Attach, Spacer Attach |
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