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Electrically and Thermally Conductive Die Attach Adhesive
ATROX 590-4HT1 is a low stress thermosetting conductive die attach adhesive with high thermal conductivity designed for high power semiconductors and exposed pad semiconductor packages. ATROX 590-4HT1 die attach adhesive has excellent adhesive strength to Cu, NiPdAu leadframes and solder-mask surfaces. ATROX 590-4HT1 has low out gassing which minimizes oven contamination and is ideal for excellent Moisture Sensitivity Level (MSL) performance.
Features
- Low stress thermosetting conductive die attach adhesive.
- Low out gassing which minimizes oven contamination and is ideal for excellent MSL performance.
- Excellent adhesive strength to Cu, NiPdAu leadframes and solder-mask surfaces.
Technical Data Sheet
ATROX 590-4HT1 TDS English
Electrically and Thermally Conductive Die Attach Adhesive
ATROX conductive die attach products offer a complete solution with lower total cost of ownership ushering in a new era of high performance materials.
ATROX 590-4HT1
|
Product Name |
Die Attach Format |
DA Funcitional Property |
Die Attach Technology |
|---|---|---|---|
|
ATROX 590-4HT1 |
Paste |
Conductive |
Polymer |
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