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Conductive Die Attach Products
ATROX conductive die attach products offer a complete solution with lower total cost of ownership ushering in a new era of high performance materials.
Features
- Very high thermal conductivity > 130 W/m-K
- Moderate stress material for small to mid size die packages.
- Compatible with multiple leadframe surfaces: Ag, Cu & PPF (NiPdAu).
Technical Data Sheet
ATROX 800HT2V Die Attach TDS English
Product Flyer
ATROX Power Package Die Attach Product Flyer English
Thermosetting Conductive Die Attach Adhesive
ATROX 800HT2V is a thermosetting conductive die attach adhesive with very high thermal conductivity designed for high power semiconductor packages.
ATROX 800HT2V has low resin bleed out and low condensable organics which ensure excellent package reliability.
ATROX 800HT2V
| Product Name | Die Attach Format | DA Functional Property | Die Attach Technology |
|---|---|---|---|
| ATROX 800HT2V | Paste | Conductive | Polymer |
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