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Conductive Die Attach Products
ATROX conductive die attach products offer a complete solution with lower total cost of ownership ushering in a new era of high performance materials.
Features
- High thermal conductivity > 70 W/m-K
- Lower stress material for mid to larger size die packages (< 50mm2).
- Compatible with multiple leadframe surfaces: Ag, Cu & PPF (NiPdAu).
Electrically and Thermally Conductive Die Attach Adhesive
ATROX 800HT5 is an ultra-low stress thermosetting conductive die attach adhesive with high thermal conductivity designed for high power exposed pad semiconductors. ATROX 800HT5 has low resin bleed out and low condensable organics which ensure excellent package reliability.
ATROX 800 HT5
ATROX 800HT5
|
Product Name |
Die Attach Format |
DA Funcitional Property |
Die Attach Technology |
|---|---|---|---|
|
ATROX 800HT5 |
Paste |
Conductive |
Polymer |
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