Electrically and Thermally Conductive Die Attach Adhesive
ATROX 590-4HT1 is a low stress thermosetting conductive die attach adhesive with high thermal conductivity designed for high power semiconductors and exposed pad semiconductor packages. ATROX 590-4HT1 die attach adhesive has excellent adhesive strength to Cu, NiPdAu leadframes and solder-mask surfaces. ATROX 590-4HT1 has low out gassing which minimizes oven contamination and is ideal for excellent Moisture Sensitivity Level (MSL) performance.
Features
- Low stress thermosetting conductive die attach adhesive.
- Low out gassing which minimizes oven contamination and is ideal for excellent MSL performance.
- Excellent adhesive strength to Cu, NiPdAu leadframes and solder-mask surfaces.
Technical Data Sheet
![TDS-icon](/sites/default/files/2021-08/Documentation%20icon%20-%20TDS.jpg)
ATROX 590-4HT1 TDS English
![ATROX-DIE-ATTACH](/sites/default/files/2021-07/SS-dieattach-category1.jpg)
Electrically and Thermally Conductive Die Attach Adhesive
ATROX conductive die attach products offer a complete solution with lower total cost of ownership ushering in a new era of high performance materials.
ATROX 590-4HT1
Product Name |
Die Attach Format |
DA Funcitional Property |
Die Attach Technology |
---|---|---|---|
ATROX 590-4HT1 |
Paste |
Conductive |
Polymer |