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Product Overview
ViaForm chemistry is produced in our high volume manufacturing (HVM) and advanced research facilities based in West Haven, Connecticut, USA. The HVM features computer-integrated manufacturing, including fully automated, enclosed chemical distribution and dedicated processing streams. The facility ensures stringent batchto-batch control and consistency, readily meeting the demanding manufacturing requirements worldwide.
- Custom solution packages based on the latest ViaForm products through our close customer collaborations
- Capable of meeting manufacturing needs of the most advanced processing nodes
- Pioneering advanced Cu technologies with proven uniform interconnect fill and superior reliability
Damascene Flyer English
Advanced Copper Plating Technology
ViaForm offers a clear advantage in meeting the demands of shrinking device geometries while giving chip manufacturers the flexibility of using their existing processes and tool systems. This is especially important in the manufacturing of memory and logic devices. New generation process technology provides a high degree of process control.
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