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Product Overview
ALPHA NCX-PRL507 epoxy flux is engineered for ball drop on wafer and flip chip attach processing. This halide & halogen-free epoxy flux allows a fully formed lead-free solder joint to occur prior to the formation of a polymer reinforcement layer (PRL) around the solder/pad interface. ALPHA NCX-PRL507 was specifically developed with a higher Tg to provide significant improvement to the drop shock and temperature cycling reliability performance of final assembled packages.
Features
- Superior activity, wetting, and assembly yield rates
- High Tg polymer reinforcement layer
- Excellent material stability – maintains tack and viscosity over multiple print cycles
- Improved ball shear strength, drop shock, and temperature cycle reliability performance
Halogen Free, Ultra-Low Residue No-Clean Flux for Flip Chip Attach, And Pop Stacking Applications
Technical Data Sheets
ALPHA NCX-PRL507 Technical Data Sheet English
ALPHA NCX-PRL507
|
Product Name |
Flux Type |
Flux Process |
Component Type |
|---|---|---|---|
|
ALPHA NCX-PRL507 |
Polymer Flux |
Ball Attach |
WLP |
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