Search
Product Overview
ALPHA OA1303 water soluble spray flux is engineered to be used in the wafer bump reform process for a variety of tin lead eutectic, lead free, solder cap copper pillar and high lead bump alloys. ALPHA OA1303 is a halogen free material with highly differentiable performance advantages in the areas of spin/spray coating processes.
Features
- Excellent activity allows for superior wetting, maximizing wetting and bump reforming
- Best adapted to bump forming process of lead free SAC alloys
- Excellent cleanability; residues are easily cleaned with DI water
- Suitable for various wafer sizes up to 300mm
Water Soluble Spray Flux for Wafer Bump Applications
Technical Data Sheets
ALPHA OA1303 Technical Data Sheet English
ALPHA OA1303
|
Product Name |
Flux Type |
Flux Process |
Component Type |
|---|---|---|---|
|
ALPHA OA1303 |
Liquid Flux |
Wafer Reform |
WLP |
What do you need solved?
Let our experts find your solution.
Let our experts find your solution.