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Product Overview
ALPHA WS-608 water soluble flux is engineered to be used in the soldering of a variety of lead-free and tin-lead eutectic alloys onto area array packages.
The flux is highly compatible with Cu-OSP, electrolytic Ni-Au, and ENIG pad finishes. ALPHA WS-608 can be used as a pre-cleaning flux for oxidized Cu-OSP boards. Its high activity formulation allows it to also be used as a single-step ball attach flux on Cu-OSP boards. It is a halogen-free compliant material with very high fluxing activity for performance advantages in the areas of wetting, spread, and missing ball rate/yield.
Features
- Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process
- Superior wetting maximizing assembly yields to provide highest ball attach yield rates
- Excellent cleanability performance in that residues are easily cleaned with DI water
High Activity Water-Soluble Flux for Semiconductor Applications
ALPHA WS-608 Technical Data Sheet English
ALPHA WS-608
|
Product Name |
Flux Type |
Flux Process |
Component Type |
|---|---|---|---|
|
ALPHA WS-608 |
Water Soluble |
Ball Attach |
BGA / CSP |
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