Product Overview

ALPHA WS-698 water soluble flux is engineered to be used in the soldering of a variety of lead-free and tin-lead eutectic alloys onto area array packages.

The flux is highly compatible with Cu-OSP, electrolytic Ni-Au, and ENIG pad finishes. ALPHA WS-698 is a halogen-free compliant material with high fluxing activity for performance advantages in the areas of wetting, spread, and missing ball rate/yield.

Features

  • Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process 
  • Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates 
  • Excellent cleanability performance in that residues are easily cleaned with DI water

High Activity Water Soluble Flux for Semiconductor Applications

Technical Data Sheets
TDS-icon

ALPHA WS-698 Technical Data Sheet English

ALPHA WS-698

Product NameFlux TypeFlux ProcessComponent Type
ALPHA WS-698Water SolubleBall Attach
Flip Chip Attach
BGA / CSP
FC
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