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Product Overview
ALPHA WS-630 water soluble flux is engineered to be used in the soldering of a variety of lead-free and tin-lead eutectic alloys onto area array packages.
The flux is highly compatible with Cu-OSP, electrolytic Ni-Au, and ENIG pad finishes. ALPHA WS-630 is a halogen-free compliant material with very high fluxing activity for performance advantages in the areas of wetting, spread, and missing ball rate/yield.
ALPHA WS-630 is also compatible with laser assisted bonding processes.
Features
- Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process
- Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates
- Excellent cleanability performance in that residues are easily cleaned with DI water
High Activity Water-Soluble Flux for Semiconductor Applications
Technical Data Sheets
ALPHA WS-630 Technical Data Sheet English
ALPHA WS-630
|
Product Name |
Flux Type |
Flux Process |
Component Type |
|---|---|---|---|
|
ALPHA WS-630 |
Water Soluble |
Ball Attach |
BGA / CSP |
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