Search
TPCA Taiwan High Tech Forum
MacDermid Alpha’s Circuitry line of business provides a full portfolio of specialty chemical solutions for the most complex printed circuit board and IC substrate designs. Our specialty electronics technologies solve industry challenges in the manufacturing of HDI, SLP, and IC substrates for today's devices as well as offering sustainable solutions to help our customers meet their ESG goals.
A Full Portfolio to Support the Electronics Manufacturing Industry
Direct Metallization
Direct Metallization technologies are a sustainable alternative to electroless copper, enabling lower water usage, less waste generation, smaller equipment footprints, and palladium-free activation for significant operations savings.
Flyer - Direct Metallization Sustainability Charts
Flyer - Direct Metallization vs Electroless Copper
Flyer - Blackhole®
Flyer - Shadow® Plus
Electrolytic Metallization
Copper via fill solutions specially engineered to fill blind micro vias and through holes as well as plate through hole walls.
Flyer - MacuSpec™ HT-360
Flyer - MacuSpec™ VF-TH 200/300
IC Substrates
Our portfolio of IC substrate chemicals provides solutions for the most technically challenging high-density designs.
Flyer - Systek™ SAP
Final Finishes
Industry leading portfolio of surface preparation and plating processes make us the market choice for organic and metallic final finishes.
Flyer - Sterling®
Flyer - Affinity™ 3.0
Flyer - Affinity™ Flex
Circuit Formation
A wide portfolio of chemical treatments for the copper surfaces that make up the circuitry of printed circuit boards and IC substrates.