Technical Bulletins

专门为优秀的线路板焊接外观并为消除焊球和焊料桥连风险而研发。

Specifically developed to deliver high reliability and excellent soldering performance combined with outstanding board cosmetics and pin-testability. 

은 뛰어난 보드 외관 및 핀 테스트 가능성과 결합 된 높은 신뢰성과 우수한 납땜 성능을 제공하기 위해 특별히 개발되었습니다. 

Low-solids, alcohol-based, no-clean rework flux, specifically developed to deliver excellent rework soldering performance combined with high reliability and outstanding board cosmetics. 

为了保持良好的返工焊接性能以及高稳定性和出色的线路板外观而专门设计的。

High-reliability, IPC, Bellcore and JIS compliant, low solids, no-clean flux. 

专为需要高可靠性，卓越的焊接性能且结合杰出的电路板外观和针测性能应用而研发。

专为需要高可靠性，卓越的焊接性能且结合杰出的电路板外观和针测性能应用而研发。

Alcohol based flux designed to optimize solderability and reliability. 

一种为优化焊接性和可靠性而设计的醇基助焊剂。

Alcohol based flux designed to optimize solderability and reliability. It is formulated for both standard and thicker, high density PCBs in lead-free processes. 

一种为优化可焊性和可靠性而开发的醇基助焊剂。