Technical Bulletins

A no clean cored solder wire that is specifically designed to meet JIS Grade AA requirements, with halide content <1,000ppm, for no-clean lead-free applications.

Burr-free, non-collapse copper discs coated with a barrier layer of nickel & finish coated with flash gold designed to be automatically placed & reflowed onto a printed circuit board pad printed with a nominal amount of solder paste.

Flux Thinner

Internal Flux Cored Solder Washers

Can be used for touch-up or rework in conjunction with the use of ALPHA UP-78 solder paste.

No-Clean Solder Paste

A lead-free solder alloy designed to enable low temperature processes. 

A lead-free solder alloy designed to enable low temperature processes. 

A lead-based alloy containing both silver and tin.