Technical Bulletins

A halide-free organic flux that is designed for semiconductor component lead tinning and PCB soldering. Provides good activity on metals such as Nickel Iron (Alloy 42), nickel plate and copper alloy.

A high-activity, organic flux designed for lead-free automated wave solder applications.  Provides maximum capillary wetting action up plated through-holes, making it ideal for use on multilayer boards.

A high activity, organic acid flux designed for automated wave solder applications where a more aggressive flux is required to solder difficult assemblies.

A high activity, organic flux designed for automated soldering of circuit board assemblies where a more aggressive flux is required, but reliability considerations are paramount.

A high activity 11% solids organic flux designed for automated soldering of circuit board assemblies where a more aggressive flux is required, but reliability considerations are paramount.

An organic water soluble flux-pen for leaded and lead-free alloys designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies.

An innovation in organic acid, water soluble flux chemistry for soldering circuit board assemblies.

No-clean cored solder wire for lead-bearing and lead-free alloys designed to complement low residue liquid fluxes being used by the electronics industry.

No-Clean Internally Fluxed Preforms for Lead-Free and Leaded Alloys.

Zero-Halogen, No-Clean Cored Wire for Robotic & Manual Soldering