Technical Bulletins

A buffered, alkaline concentrated formula which effectively removes both organic and inorganic acid flux residues.

A highly concentrated liquid cleaner which is added to water to make a non-foaming solution for removing rosin flux residue.

A highly concentrated liquid cleaner which is added to water to form a non-foaming solution for removing rosin flux residue.

A non-silicone formulation designed to eliminate excessive foam in aqueous cleaning systems using tap, filtered or DI water.

A solution of inorganic salts and other additives designed for general tinning applications. Not meant for electronics soldering.

A mild flux developed for soldering nickel-chrome and stainless steel alloys where regular acid fluxes are not active enough to remove the resistant oxide coatings.

Rosin Cored Wire for Leaded and Lead-free Alloys

Activated Rosin Internal Flux for Preforms

A lead-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the Sn96.5Ag3.0Cu0.5 alloy.

A low solids no-clean flux designed for wave soldering conventional and surface mount circuit board assemblies.

A non-rosin organic flux designed for wave soldering conventional and surface mount circuit board assemblies. 

A low-solids, no-clean, non-rosin, organic liquid flux designed for wave soldering conventional and surface mount circuit board assemblies.