Technical Bulletins

ALPHA CVP-390 Innolot deploys the Innolot alloy in a zero-halogen, no-clean solder paste flux system, which provides excellent pin testing properties and ability to pass the most demanding electro-chemical reliability standards. 

No-clean flux engineered to be used in the placement and reflow of lead-free solders for BGA attach processes. 

Lead-free, zero-halogen, no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. 

Lead-free, no-clean solder paste designed to maximize flexibility in manufacturing and provide excellent electrochemical reliability in harsh operating conditions. 

旨在最大程度提高生产的灵活性，旨在最大限度提高生产的灵活性，并在恶劣操作条件下实现优异的电化学可靠性。

一款免清洗助焊剂，可用于BGA焊接工艺的无铅焊料贴装和回流焊。

一款无铅，完全不含卤素的免清洗锡膏，专为要求焊接残留物具有优异在线测试性能并且符合JIS标准铜腐蚀性测试的应用而设计。

A no-clean paste flux designed to enable low temperature surface mount assembly.

Low melting point, drip resistant, no-clean, lead-free, halogen-free solder paste.

No-clean flux designed to enable low temperature surface mount assembly technology. 

Low-melting point, no-clean, lead-free, zero-halogen solder paste. 

专为了满足低温表面贴装技术的应用而设。