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Product Overview
ALPHA EF-8800HF is a mid-solids, alcohol-based flux designed for both standard and thicker, high-density PCBs in leaded and lead-free process.
With special thermally stable activators in the formulation, this flux shows stable performance across different preheating temperatures and dwell times. It delivers exceptional hole-fill even under long exposure to higher preheat and higher solder pot temperature, thus delivering low bridging on bottom side QFPs, as well as provide superior performance in hole-fill and solderballing.
Additionally, ALPHA EF-8800HF provides good lead-free solder joint cosmetics with an evenly spread, tack-free residue, reducing defects in pin testing.
Product Features
- Halogen-free
- Wide process window
- Robust soldering performance under high top-side preheat (>125⁰C), high pot temperatures (>270⁰C) and long dwell times (>7 seconds)
- Excellent hole fill demonstrated on thick board
- High reliability meeting the toughest ECM/SIR IPC 004B requirements
- ORL0 per IPC J Std-004B
High Reliability Halogen-Free Thick Board Flux
ALPHA EF-8800HF meets the toughest reliability and soldering requirements for challenging thick board applications.
The unique activators and rosin package accommodate more rosin for better soldering and reliability performance in high thermal excursion process while leaving clean, non-tacky and pin testable residues on-boards.
ALPHA EF-8800HF is halogen-free.
Related Products
- Thich Board Capable
- Wide Process Window
- Halogen-Free
- High Reliability
|
Product Type |
Product Name |
Halogen Free |
Solid Content |
Pin Testability |
Best Used Assembly Type |
|---|---|---|---|---|---|
|
Liquid Flux |
YES |
M |
**** |
II, III, IV |
|
|
Liquid Flux |
No |
L |
***** |
II, III, IV |
|
|
Liquid Flux |
YES |
L |
***** |
II, III, IV |
|
|
Liquid Flux |
No |
M |
**** |
II, III, IV |
|
|
Rework Flux |
YES |
VL |
***** |
I,II,III |
|
|
Cored Wire |
YES |
N/A |
***** |
N/A |
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