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Product Overview
Kester NF372-TB is a low solid alcohol based flux designed for both standard and thicker, high-density PCBs. It can be used with both leaded and lead-free alloys.
One of its best features is the ability to withstand long dwell times and high preheat temperatures needed in thick board assemblies. Sustained activity within the flux allows for good barrel fill in challenging applications, such as reflowed copper OSP boards or with difficult to solder components.
Kester NF372-TB residues are minimal, clear and non-tacky for improved cosmetics.
Product Features
- Zero-halogen
- Suitable for longer soak (> 5 seconds) in high preheat (>125°C) and high solder pot temperature processes
- Excellent hole fill demonstrated even on board thickness > 3.0mm
- High reliability meeting the toughest ECM/SIR IPC 004B requirements
- ROL0 per IPC J-STD-004B
High Reliability Halogen Free Thick Board Flux
Kester NF372-TB was designed to withstand challenging heating profiles, performing better than standard fluxes.
NF372-TB exhibits sustained activity at elevated temperatures and long dwell, delivers excellent hole-fill with minimal non-tacky residue.
With a special blend of chemistry, this flux passes stringent reliability tests in industries even in low solid formulation.
Kester NF372-TB is pallet friendly and does not attack pallet materials.
Related Products
- Low Residue
- Thick Board Capable
- Wide Process Window
- Halogen-Free
- High Reliability
|
Product Type |
Product Name |
Halogen Free |
Solid Content |
Pin Testability |
Best Used Assembly Type |
|---|---|---|---|---|---|
|
Liquid Flux |
YES |
M |
**** |
II, III, IV |
|
|
Liquid Flux |
YES |
L |
***** |
II, III |
|
|
Liquid Flux |
No |
L |
***** |
II, III, IV |
|
|
Liquid Flux |
YES |
M |
**** |
II, III, IV |
|
|
Liquid Flux |
No |
M |
**** |
II, III, IV |
|
|
Rework Flux |
YES |
VL |
***** |
I, II, III |
|
|
Cored Wire |
YES |
N/A |
***** |
N/A |
|
|
Cored Wire |
YES |
N/A |
***** |
N/A |
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