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Product Overview
ALPHA Argomax 2047 is a nano-Silver sintering paste developed to meet the increasing demand of large area attach applications (module to baseplate and heat-sink attach) by providing a thick bond line, ensuring a reliable attachment between surfaces.
Product Features
- Application: Package/Module Attach, Substrate Attach
- Formulated for printing on Ag/Au surfaces
- Designed for component placement on wet paste with high tack
- Pure Silver bond line for high performance (thermal and electrical conductivity) and reliability
- Flexible bond line thickness
- Low sintering pressure for high yield manufacturing
Low thermal resistance and superior inverter reliability at high ∆T
ALPHA Argomax 2047 sintering technology has proven that its low thermal and electrical impedance results in superior reliability at extreme temperature swings inherent in EV Traction applications.
Printable Silver Paste
As a printable paste designed for pressure sintering of large packages or components on gold and silver finishes, ALPHA Argomax 2047 enables manufacturers to use existing printing equipment, decreasing their total cost of ownership.
Related Products
| Product Type | Product Name | Compatible Surface Finish | Product Application Method | End Application |
|---|---|---|---|---|
| Sinter Paste | ALPHA Argomax 2048 Paste | Ag, Au | Large Area Dispense | Package/Module Attach, Substrate Attach |
| Engineered Sinter Product | ALPHA Argomax 9200 Preform | Ag, Au | Pick & Place | Die Top Attach, Package/Module Attach, Substrate Attach, Spacer Attach |
| Engineered Sinter Product | ALPHA Argomax 9500 Preform | Cu | Pick & Place | Die Top Attach, Package/Module Attach, Substrate Attach, Spacer Attach |
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