Sintering Package Attach

The most significant contributors to the overall thermal resistance (R_th) from die to heat sink are the interconnect materials, including the thermal interface material (TIM). 

These interconnect materials can account for >50% of the total.  By replacing the TIM or solder with a thinner, highly conductive pressure sinter layer, the R_th decreases by 10-15%. 

This change also improves reliability by managing the stress and warpage between the package and heat sink.

A sintering solution with flat nozzle dispense enables the application ALPHA Argomax paste for an entire inverter in <20 seconds.  The paste ensures intimate contact between the package and the heat-sink, accommodates warpage, and sinters with low pressure without cracking the molded package. 

ALPHA Argomax, based on proprietary nano-particle technology is the only viable sintering solution for package to heat-sink attach.