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Product Overview
ALPHA WS-809 is a SnPb water soluble solder paste formulated to offer excellent cleanability after multiple reflows. This paste exhibits superior resistance to slump and drying under harsh processing conditions.
ALPHA WS-809 is formulated to offer flexibility across printing speeds ranging from 1”/sec (25 mm/s) to 6”/sec (150 mm/s) with stencil thicknesses of 5 mil (0.125 mm) to 6 mil (0.15 mm).
Product Features
- High throughput & yield with consistent print volumes at print speeds ranging 1–6 in/s
- Exhibits resistance to slumping and drying at temperature up to 19-29 °C (66 – 84°F) and 35-65% relative humidity
- Excellent cleanability after 2 reflows
Technical Bulletin
ALPHA WS-809 Technical Bulletin English
Excellent stencil life in harsh processing conditions
ALPHA WS-809 exhibits robust stencil life at temperature ranges from 19-29 °C (66 – 84°F) and 35-65% relative humidity.
This solder paste is resistant to slump at elevated environmental conditions and viscosity increased in low humidity environments making it an excellent option for SnPb assemblies in high throughput environments.
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