Lead Pastes for Printing
- High print speeds
- Harsh manufacturing conditions
- Fine feature printability
- High Cp / CpK print deposit volume
PRODUCT Name | DESCRIPTION | KEY FEATURES |
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ALPHA OM-565 HRL3 Solder Paste | Enables 175 °C peak reflow temperature to enhance mechanical reliability while improving energy efficiency of assembly process. |
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Designed to offer improved drop shock and thermal cycling performance versus existing low temperature alloys. |
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A lead-free no-clean solder paste designed to maximize flexibility in manufacturing and provide superior electrochemical reliability in the most challenging applications. |
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Lead-Free, zero halogen solder paste designed for broad latitude, high reliability applications, requiring process flexibility and residue containment. |
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