Product Overview

ALPHA SACX Plus HASL is a lead-free alloy suitable for use as a replacement for Sn63 alloy in the hot air solder level process.

The SACX Plus HASL variant is used to stabilize / reduce the copper content in the hot air solder level machine solder bath, this requirement will depend on process conditions.

Our proprietary Vaculoy alloying process is used to remove impurities, particularly oxides. The product is further enhanced with the addition of 2 minor elements to reduce copper dissolution rates and improve the pad cosmetics.

ALPHA Triangular Bar

Product Features

  • Lowers total cost of ownership due to lower material cost, high yields and low copper dissolution rate
  • Excellent solderability due to fast wetting speed, improves hole fill on multiple reflow boards
  • Compatible with all assembly SAC based alloys
  • Excellent shelf life
Technical Bulletins
Documentation icon - Technical Bulletin

ALPHA SACX Plus HASL Technical Bulletin English

Documentation icon - Technical Bulletin

ALPHA SACX Plus HASL 技术公告 简体中文

Key Requirements
  • High purity, low oxides
  • Superior wetting performance, even on thicker assemblies
  • Reduced drossing and copper dissolution
     
ALPHA® SnCX® Plus 07 ALPHA® SACX® Plus 0807 ALPHA SACX® Plus 0307 ALPHA Vaculoy® SAC305, 387, 405 Solid Solder

Key Requirements
  • High purity, low oxides
  • Superior wetting performance, even on thicker assemblies
  • Reduced drossing and copper dissolution
     
ALPHA® SnCX® Plus 07 ALPHA® SACX® Plus 0807 ALPHA SACX® Plus 0307 ALPHA Vaculoy® SAC305, 387, 405 Solid Solder
Key Requirements
  • High purity, low oxides
  • Superior wetting performance, even on thicker assemblies
  • Reduced drossing and copper dissolution
Wave Soldering Selective Soldering

Key Requirements
  • High purity, low oxides
  • Superior wetting performance, even on thicker assemblies
  • Reduced drossing and copper dissolution
Wave Soldering Selective Soldering
Key Requirements
  • High purity, low oxides
  • Superior wetting performance, even on thicker assemblies
  • Reduced drossing and copper dissolution
Cost Effective Lead Free Options

Key Requirements
  • High purity, low oxides
  • Superior wetting performance, even on thicker assemblies
  • Reduced drossing and copper dissolution
Cost Effective Lead Free Options
Key Requirements
  • High purity, low oxides
  • Superior wetting performance, even on thicker assemblies
  • Reduced drossing and copper dissolution
     
ALPHA® SnCX® Plus 07 ALPHA® SACX® Plus 0807 ALPHA SACX® Plus 0307 ALPHA Vaculoy® SAC305, 387, 405 Solid Solder

Key Requirements
  • High purity, low oxides
  • Superior wetting performance, even on thicker assemblies
  • Reduced drossing and copper dissolution
     
ALPHA® SnCX® Plus 07 ALPHA® SACX® Plus 0807 ALPHA SACX® Plus 0307 ALPHA Vaculoy® SAC305, 387, 405 Solid Solder
Key Requirements
  • High purity, low oxides
  • Superior wetting performance, even on thicker assemblies
  • Reduced drossing and copper dissolution
Wave Soldering Selective Soldering

Key Requirements
  • High purity, low oxides
  • Superior wetting performance, even on thicker assemblies
  • Reduced drossing and copper dissolution
Wave Soldering Selective Soldering
Key Requirements
  • High purity, low oxides
  • Superior wetting performance, even on thicker assemblies
  • Reduced drossing and copper dissolution
Cost Effective Lead Free Options

Key Requirements
  • High purity, low oxides
  • Superior wetting performance, even on thicker assemblies
  • Reduced drossing and copper dissolution
Cost Effective Lead Free Options
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