Leading Products in Selective Soldering

PRODUCT TYPE PRODUCT NAME DESCRIPTION KEY FEATURES
Solid Solder ALPHA SACX Plus 0807  A low silver lead-free alloy specially designed with proprietary additives to deliver SAC305 like soldering and reliability performance.
  • SAC305-like performance
  • Fast wetting and wide process window
  • Strong, ductile joint for high mechanical reliability
Solid Solder ALPHA SACX Plus 0307 A low silver lead-free alloy suitable for use as a replacement for SnPb, SAC305 and other low silver SAC alloys.
  • Low Silver for lower material cost
  • Low dross rate
  • Low copper dissolution
Solid Solder ALPHA SnCX Plus 07 A no-silver, lead-free alloy suitable for use as a replacement for SnPb, SAC305 and other low silver SAC alloys in wave solder, selective soldering, lead tinning and rework processes.
  • Pin testable
  • Compatible flux chemistry for both wave and selective soldering
  • Excellent Lead-free soldering performance on various board finishes
Solid Solder ALPHA HRL3 A low temperature lead-free alloy designed to exhibit improved thermomechanical reliability and soldering performance versus existing low temperature alloys in the market.
  • Low temperature enabling in selective and dip soldering processes
  • Provides efficiencies in energy savings and reduces thermal damage
  • Comparable hole fill performance and solder joint strength vs SAC305
  •  Low Copper erosion vs SAC305
Liquid Flux Kester SELECT-10 A zero-halogen, alcohol-based, no-clean liquid flux designed specifically for the needs of the lead-free selective soldering process.
  • Zero-halogen
  • Excellent for selective soldering 
  • Controlled flux spread within localized flux spray pattern 
Liquid Flux ALPHA EF-6103 A 3.6% low solid, no-clean alcohol based flux. The activation package produces fast wetting speeds and high force leading to improved hole fill, especially on OSP substrates.
  • Pin testable
  • Compatible flux chemistry for both wave and selective soldering
  • Excellent Lead-free soldering performance on various board finishes
Liquid Flux ALPHA EF-6808HF A broad spectrum halogen-free, low solids, alcohol based, no-clean flux for use in a variety of automated and manual soldering applications.
  • For general soldering application
  • Excellent soldering performance with good hole-fill and low bridging on high density assemblies
Liquid Flux Kester NF372-TB A low solid alcohol based flux designed for both standard and thicker, high-density PCBs. One of its best features is the ability to withstand long dwell times and high preheat temperatures.
  • Zero-halogen
  • Suitable for longer soak (> 5 s) in high preheat (>125°C) and high solder pot temperature processes 
  • Excellent hole fill demonstrated even on board thickness > 3.0mm
Liquid Flux ALPHA EF-2100 A high performing ORL0, halide-free, VOC-free no-clean flux that maintains its soldering performance for excellent hole-fill and low-defect soldering in lead-free assemblies. 
  • Halide-free
  • VOC-free for lower VOC emissions
  • Exceptional wetting for excellent hole-fill, even with prior reflows
Liquid Flux

Kester NF1060-VF

 A high performing ORM0, zero-halogen, VOC-free, no-clean flux that maintains its soldering performance for excellent hole-fill and low-defect soldering in lead-free assemblies. 
  • Zero-halogen
  • VOC-free for lower VOC emissions
  • Exceptional wetting for excellent hole-fill, even with prior reflows
Liquid Flux Kester 979 A high performing ORL0, low residue, VOC-free no-clean flux that maintains its soldering performance for excellent hole fill and low-defect soldering of lead-free assemblies.
  • Halide-free
  • VOC-free for lower VOC emissions
  • Exceptional wetting for excellent hole-fill, even with prior reflows
Liquid Flux ALPHA 3355-VF A VOC-free, water soluble flux for lower VOC emissions which produces exceptional solder wetting to a wide variety of metallic surfaces and is unsurpassed in water solubility for thorough removal of post soldering residues.
  • Water soluble
  • VOC-free
  • Non-neutral pH 

 

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. We provide the products designed to meet the challenges of through hole soldering.

Soldering Alloys Cored Solder Wire Solder Preforms HiTech Adhesives and Encapsulants

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. We provide the products designed to meet the challenges of through hole soldering.

Soldering Alloys Cored Solder Wire Solder Preforms HiTech Adhesives and Encapsulants

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. We provide the products designed to meet the challenges of through hole soldering.

Wave Soldering Robotic Soldering Manual Soldering and Rework Selectively Increasing Solder Volume Gluing SMT Components

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. We provide the products designed to meet the challenges of through hole soldering.

Wave Soldering Robotic Soldering Manual Soldering and Rework Selectively Increasing Solder Volume Gluing SMT Components

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. We provide the products designed to meet the challenges of through hole soldering.

Soldering Alloys Cored Solder Wire Solder Preforms HiTech Adhesives and Encapsulants

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. We provide the products designed to meet the challenges of through hole soldering.

Soldering Alloys Cored Solder Wire Solder Preforms HiTech Adhesives and Encapsulants

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. We provide the products designed to meet the challenges of through hole soldering.

Wave Soldering Robotic Soldering Manual Soldering and Rework Selectively Increasing Solder Volume Gluing SMT Components

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. We provide the products designed to meet the challenges of through hole soldering.

Wave Soldering Robotic Soldering Manual Soldering and Rework Selectively Increasing Solder Volume Gluing SMT Components
What do you need solved?
Let our experts find your solution.
Contact Us