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Product Overview
ALPHA Precision Milled, Multi-Level Stencils are designed to enable optimal control of the paste deposits when assembling boards containing a wide variety of component sizes. They allow greater flexibility in the transition from one thickness to another and improved surface quality.
ALPHA Precision Milled Stencils are designed to produce the best printing performance by enabling less visible paste smearing and improved repeatability of print deposits. They allow reduced pressure to be used when printing stepped stencils and increased flexibility in design of the “Keep Out ” area.
Features & Benefits
- Greater flexibility in the transition from one thickness to another
- Surface roughness values in the steps closer to that of the main stencil
- Less paste smearing
- Improved repeatability of print deposits
- Reduced pressure on steps
- Enables use of Multi-level stencils on closed-head printing systems
ALPHA STEP Multi-Level, Step Stencils Technology
ALPHA STEP Multi-Level, Step Stencils Technology is available on all ALPHA Stencils and offers the SMT engineer significant flexibility in achieving the right solder paste volume deposit for devices with markedly diverse paste requirements.
They can provide additional paste height in selected areas of the PCB (step-up stencils) or reduced height deposits in other areas (step down stencils).
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