Leading Fine Feature Enabling Solder Pastes

PRODUCT NAME DESCRIPTION KEY FEATURES
ALPHA OM-372 Solder Paste A lead-free, no-clean solder paste designed for superior performance on assemblies with ultra-fine pitch components requiring excellent stencil transfer efficiency and high electrical reliability.
  • Best-in-class electrochemical reliability on fine pitched low standoff packages
  • Ultra-fine feature printing & reflow capability down to 008004 components
  • Minimum post reflow residue provides high reliability performance for fine pitch, high density designs
ALPHA CVP-390V Solder Paste A lead-free, no-clean solder paste designed to maximize flexibility in manufacturing and provide superior electrochemical reliability in the most challenging applications.
  • Exceptional pin testability to ensure first pass yields
  • Superior electrochemical performance on fine pitched components to ensure reliability on complex PCB assemblies 
  • Excellent coalescence down to 170 µm apertures on high density assemblies
ALPHA JP-500 Solder Paste ALPHA JP-500 is a lead-free, zero halogen, no-clean solder paste designed for use in Jet Printers and approved for use with leading jetting equipment manufacturers.
  • Deposit capability and processability of circular dimensions down to 0.25mm (0.010”)
  • Excellent deposit consistency with high process capability index across all board designs
  • Reduction in random solderballing levels, increasing first time yield
ALPHA JP-501 Solder Paste ALPHA JP-501 is a low temperature, lead-free, no-clean solder paste designed for use in Jet Printers.
  • Low temperature reflow profiles enables the use of low Tg PCB
  • Excellent deposit consistency with high process capability index across all board designs
  • Reduction in random solderballing levels

 

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