Thermal Management Materials

Ineffective heat dissipation of components can result in reduced reliability and operational lifetime of the device. Electrolube's all-encompassing thermal management materials effectively disperse heat away from the device. The range includes silicone and non-silicone pastes, gap fillers, encapsulation resins, gap pads and phase change materials.

Heat Sink - thermal interface - electrolube

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Electrolube® Thermal Interface Materials

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Thermal Interface Materials

Solutions to Maintain Optimal Working Temperatures in Electronic Assemblies
- Bulk thermal conductivity ranging from 0.9 up to 8.5W/m-K
- Bond line thickness from as thin as 50μm to over 5mm
- Both silicone and non-silicone formulations
- Materials can either be liquid applied or provided in sheet format
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