STAYSTIK 181AK is characterized by its excellent bonding properties.

The paste can be used for die, lid seal and/or substrate attach in hybrid, multi-chip modules (MCMs) or other microelectronic packages.

The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.

Features

  • Meets MIL STD 883 requirements
  • Extremely low outgassing
  • Fast bonding to a variety of substrates
     
Technical Data Sheet
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STAYSTIK 181AK Adhesive Technical Data Sheet English

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STAYSTIK 181AK

Product Name

Adhesive Type

Adhesive Format

Adhesive Technology

Adhesive Application

Deposition Method

Silver

STAYSTIK 181AK

Conductive

Paste

Electrically
Conductive

Structural Bonding
Reworkable
Die Attach

Dispensing

Silver

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 581 STAYSTIK 181

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 581 STAYSTIK 181

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Aerospace Applications Medical Devices Wafer Fabrication Laminate Packaging Optoelectroncis

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Aerospace Applications Medical Devices Wafer Fabrication Laminate Packaging Optoelectroncis

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding Thermal Management

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding Thermal Management

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 581 STAYSTIK 181

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 581 STAYSTIK 181

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Aerospace Applications Medical Devices Wafer Fabrication Laminate Packaging Optoelectroncis

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Aerospace Applications Medical Devices Wafer Fabrication Laminate Packaging Optoelectroncis

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding Thermal Management

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding Thermal Management
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