High performance applications that use epoxy TIMs are approaching their limitations. Solder based TIMs have higher thermal conductivity properties for the next generation thermal management solutions. MacDermid Alpha thermal management solutions is focused on solder based TIM.
MacDermid Alpha thermal interface materials are solder based with higher thermal conductivity as compared to epoxy TIM. One of MacDermid Alpha TIM thermal solution is Indium metal which has a thermal conductivity of 86W/mK which is much higher than epoxy based TIM. Indium solder TIM make it an ideal solution to solve next generation thermal cooling challenges.
Please see Products page for details.
Please see Products page for details.
Please see Applications page for details.
Please see Applications page for details.
Please see Products page for details.
Please see Products page for details.
Please see Applications page for details.
Please see Applications page for details.
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