Product Overview

STAYSTIK 191 thermoplastic adhesive paste is designed for use in a variety of electronic applications. STAYSTIK 191 is characterized by its excellent bonding at low process temperatures. The properties of this adhesive make it exceptional for heatsink bonding as well as TAB bonding to PCB. The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.

Features

  • Fast bonding to a variety of substrates
  • Easily reworkable material
Technical Data Sheet
TDS-icon

STAYSTIK 191 Adhesive Technical Data Sheet English

Download

STAYSTIK 191

Product Name

Adhesive Type

Adhesive Format

Adhesive Technology

Adhesive Application

Deposition Method

Silver

STAYSTIK 191

Conductive

Paste

Electrically Conductive

Structural Bonding
Reworkable
Wafer Coating
Temporary Bonding

Dispensing
Screen Printing
Wafer Coating

Silver

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 591

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 591

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Aerospace Applications Optoelectronics Packaging Medical Devices

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Aerospace Applications Optoelectronics Packaging Medical Devices

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding Thermal Management

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding Thermal Management

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 591

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 591

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Aerospace Applications Optoelectronics Packaging Medical Devices

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Aerospace Applications Optoelectronics Packaging Medical Devices

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding Thermal Management

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding Thermal Management
What do you need solved?
Let our experts find your solution.
Contact Us