Product Overview

STAYSTIK 292 thermoplastic adhesive paste is designed for use in a variety of electronic applications. STAYSTIK 292 is characterized by excellent bonding at low process temperatures. Its properties make it exceptional for heatsink bonding as well as TAB bonding to PCB. The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.

Features

  • Fast bonding to a variety of substrates
  • Easily reworkable material
Technical Data Sheet
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STAYSTIK 292 Adhesive Technical Data Sheet English

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STAYSTIK 292

Product Name

Adhesive Type

Adhesive Format

Adhesive Technology

Adhesive Application

Deposition Method

Silver

STAYSTIK 292

Non-conductive

Paste

Thermally Conductive

Structural Bonding
Reworkable
Wafer Coating
Temporary Bonding

Dispensing
Screen Printing
Wafer Coating

Aluminum Nitride

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Aerospace Applications Optoelectronics Packaging Medical Devices

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Aerospace Applications Optoelectronics Packaging Medical Devices

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding Thermal Management

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding Thermal Management

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Aerospace Applications Optoelectronics Packaging Medical Devices

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Aerospace Applications Optoelectronics Packaging Medical Devices

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding Thermal Management

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding Thermal Management
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