Product Overview

STAYSTIK 383 thermoplastic adhesive paste is designed for use in a variety of electronic applications, and is characterized by excellent bonding properties. STAYSTIK 383 is suitable for die and/or substrate attach in hybrid or multi-chip modules (MCMs). The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.

Features

  • Meets MIL STD 883 requirements
  • Extremely low outgassing
  • Fast bonding to a variety of substrates
Technical Data Sheet
TDS-icon

STAYSTIK 383 Adhesive Technical Data Sheet English

Download

STAYSTIK 383

Product Name

Adhesive Type

Adhesive Format

Adhesive Technology

Adhesive Application

Deposition Method

Silver

STAYSTIK 383

Non-conductive

Paste

Insulating

Structural Bonding
Reworkable

Dispensing
Screen Printing
Wafer Coating

None

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 482

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 482

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Sensors Aerospace Applications Optoelectronics Packaging Medical Devices

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Sensors Aerospace Applications Optoelectronics Packaging Medical Devices

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 482

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 482

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Sensors Aerospace Applications Optoelectronics Packaging Medical Devices

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Sensors Aerospace Applications Optoelectronics Packaging Medical Devices

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Temporary Bonding
What do you need solved?
Let our experts find your solution.
Contact Us