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Product Overview
STAYSTIK 482 thermoplastic adhesive film is designed for use in a variety of electronic applications, and is characterized by excellent bonding properties. STAYSTIK 482 can be used for die attach and/or substrate attach in hybrid or multi-chip modulus (MCMs). The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.
Features
- Meets MIL STD 883 requirements
- Extremely low outgassing
- Fast bonding to a variety of substrates
Technical Data Sheet
STAYSTIK 482 Adhesive Technical Data Sheet English
STAYSTIK 482
|
Product Name |
Adhesive Type |
Adhesive Format |
Adhesive Technology |
Adhesive Application |
Deposition Method |
Silver |
|---|---|---|---|---|---|---|
|
STAYSTIK 482 |
Non-conductive |
Film Preforms |
Insulating |
Structural Bonding |
Lamination |
None |
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