Product Overview
STAYSTIK 793 thermoplastic adhesive paste is designed for use in a variety of electronic applications, and is characterized by excellent bonding at low process temperatures. Its properties make it exceptional for heatsink or substrate bonding as well as TAB bonding to PCB. The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.
Features
- Fast bonding to a variety of substrates
- Easily reworkable material
Technical Data Sheet
STAYSTIK 793 Adhesive Technical Data Sheet English
STAYSTIK 793
Product Name |
Adhesive Type |
Adhesive Format |
Adhesive Technology |
Adhesive Application |
Deposition Method |
Silver |
---|---|---|---|---|---|---|
STAYSTIK 793 |
Non-conductive |
Paste |
Thermally Conductive |
Structural Bonding |
Dispensing |
Aluminum Oxide |